PROME-Photonic
3D Lithography Equipment Specialized for Photonic Chipserization
Category:
3D Micro-nano Processing / Nano 3D Printing Equipment
Keywords:
3D Micro-nano Processing/Nano 3D Printing Equipment
Prome-Photonic is a high-performance direct laser writing device designed specifically for enabling Photonic Wire Bonding (PWB) technology in the field of photonic chip integration. It features high-precision nano-scale 3D processing capabilities and high-accuracy positioning & alignment capabilities, dedicated to addressing the core challenges of high-precision interlayer interconnection and heterogeneous packaging in 3D integration of photonic chips. Leveraging Multi-Photon Polymerization (MPP) technology, it achieves true 3D processing of submicron-level free-form surface structures, providing a disruptive manufacturing platform for the hybrid integration of silicon photonics chips, lithium niobate photonic circuits, and quantum optical devices.
Prome-Photonic adopts the principle of Multi-Photon Polymerization (MPP), with a minimum line width of less than 100 nanometers and a surface roughness controllable below 10 nanometers. This enables high-precision nano-scale 3D processing on photonic chips.
The high-precision processing and positioning & alignment capabilities of Prome-Photonic will provide crucial support for photonic chip integration technology, facilitating greater innovation and breakthroughs in the field of photonic chip integration. Whether in research institutions or industrial applications, Prome-Photonic will meet the high-precision positioning and processing needs of different applications in the photonic chip integration field.
Equipped with ultra-high-speed processing capabilities, Prome-Photonic can achieve a processing speed of ≥6 layers per second across the full writing field while maintaining 100nm processing accuracy. In high-speed processing scenarios, it can process up to 40 million voxels per second. This significantly improves production throughput while simultaneously ensuring processing accuracy and positioning & alignment accuracy, advancing the industrial-scale application of photonic integration technology.
Key Features
➤ Ultra-high-speed processing module for drastically improved processing efficiency
➤ High-precision 3D processing, enabling the design and fabrication of complex structures with arbitrary free-form surfaces
➤ Confocal and fluorescence detection system for high-accuracy position identification and alignment
➤ CNano-precision automatic 3D alignment and positioning system
➤ Real-time high-definition microscopic imaging and measurement, with a global coordinate system for both processing and inspection
➤ Vacuum adsorption sample stage, compatible with various substrate materials
➤ Dedicated fixtures for optical fibers, fiber arrays, and photonic chips
➤ Automatic laser power compensation to eliminate the impact of end-face processing defects
➤ Automatic substrate tilt detection and leveling
➤ Visual programming for customizable processing workflows
Applications
Test for the Minimum Line Width
3D Structure on hair surface
Photonic bridging for chip-to-chip
Customer Service
➤ Pre-sales customized service
We offer professional solutions according to customer processing needs; provide post-application expansion, reserved hardware and software interfaces.
➤ Technical service support
We provide hotline, remote control and on-site support; Provide users performance optimization, daily maintenance, parts replacement, application expansion and upgrade of the system.
➤ Lifetime application support
We provide free software upgrade, provide support such as test schemes, application operations, result analysis, and provide maintenance and solutions for common faults.
➤ Lifetime maintenance support
Equipped with professional maintenance engineers, 2 hours response, 72 hours to arrive at the scene.We provide extended warranty service, free training and lifetime maintenance.
Product Inquiry
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