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PROME-Photonic

3D Lithography Equipment Specialized for Photonic Chipserization


Category:

3D Micro-nano Processing / Nano 3D Printing Equipment

Keywords:

3D Micro-nano Processing/Nano 3D Printing Equipment

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Prome-Photonic is a high-performance direct laser writing device designed specifically for enabling Photonic Wire Bonding (PWB) technology in the field of photonic chip integration. It features high-precision nano-scale 3D processing capabilities and high-accuracy positioning & alignment capabilities, dedicated to addressing the core challenges of high-precision interlayer interconnection and heterogeneous packaging in 3D integration of photonic chips. Leveraging Multi-Photon Polymerization (MPP) technology, it achieves true 3D processing of submicron-level free-form surface structures, providing a disruptive manufacturing platform for the hybrid integration of silicon photonics chips, lithium niobate photonic circuits, and quantum optical devices.

Prome-Photonic adopts the principle of Multi-Photon Polymerization (MPP), with a minimum line width of less than 100 nanometers and a surface roughness controllable below 10 nanometers. This enables high-precision nano-scale 3D processing on photonic chips.

The high-precision processing and positioning & alignment capabilities of Prome-Photonic will provide crucial support for photonic chip integration technology, facilitating greater innovation and breakthroughs in the field of photonic chip integration. Whether in research institutions or industrial applications, Prome-Photonic will meet the high-precision positioning and processing needs of different applications in the photonic chip integration field.

Equipped with ultra-high-speed processing capabilities, Prome-Photonic can achieve a processing speed of ≥6 layers per second across the full writing field while maintaining 100nm processing accuracy. In high-speed processing scenarios, it can process up to 40 million voxels per second. This significantly improves production throughput while simultaneously ensuring processing accuracy and positioning & alignment accuracy, advancing the industrial-scale application of photonic integration technology.

 

Key Features

Ultra-high-speed processing module for drastically improved processing efficiency
High-precision 3D processing, enabling the design and fabrication of complex structures with arbitrary free-form surfaces
Confocal and fluorescence detection system for high-accuracy position identification and alignment
CNano-precision automatic 3D alignment and positioning system
Real-time high-definition microscopic imaging and measurement, with a global coordinate system for both processing and inspection

Laser energy stabilization system to ensure consistency in long-duration processing
Vacuum adsorption sample stage, compatible with various substrate materials
Dedicated fixtures for optical fibers, fiber arrays, and photonic chips
Automatic laser power compensation to eliminate the impact of end-face processing defects
Automatic substrate tilt detection and leveling
Visual programming for customizable processing workflows

 

 

Applications

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Test for the Minimum Line Width

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3D Structure on hair surface

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Photonic bridging for chip-to-chip

 

Customer Service

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Pre-sales customized service
We offer professional solutions according to customer processing needs; provide post-application expansion, reserved hardware and software interfaces.

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Technical service support
We provide hotline, remote control and on-site support; Provide users performance optimization, daily maintenance, parts replacement, application expansion and upgrade of the system.

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Lifetime application support
We provide free software upgrade, provide support such as test schemes, application operations, result analysis, and provide maintenance and solutions for common faults.

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Lifetime maintenance support
Equipped with professional maintenance engineers, 2 hours response, 72 hours to arrive at the scene.We provide extended warranty service, free training and lifetime maintenance.

 

Product Inquiry

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