Micro-nano optics-Yantai Moji-Nano Technology Co., Ltd.

Optoelectronic integrated chip and network integration

The integrated chips, especially photonic chips, usually require to bond different types of chips. Using 3D direct laser writing with nano-precision, we can bond the fixed-point between different chips without two-step operation. The photonic wire bonding based on 3D direct laser writing is a simple, highly accurate fabrication process, resulting in low transmission loss.

Advantages:
1. Realizing low-loss connections between silicon-based optoelectronic chip networks
2. Realize automatic connection of silicon-based photonic chip network and improve the connection efficiency
3. Improving the integration of silicon-based photonic chips
4. Realizing the 3D free connection between silicon-based photonic chips

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