MN-UV-Ultra

Maskless direct laser writing
equipment

Maskless 2D/3D lithography with nanoscale resolution

Ultra-high-speed processing for industrial purpose empowered by patented technology

Minimal stitching error

Compatible with up to 12-inch substrate

Fully automatic system

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Technical specifications

Type:Standard

Minimum line width:0.8 µm

Minimum lines and spaces:1 µm

Edge roughness:0.04 µm

CD uniformity:0.08 µm

Alignment measurement accuracy(100*100 mm²):0.6 µm

Maximum write speed:75 mm² /min

Maximum exposure area:100*100 mm²

Light source LED/Laser:405/365 nm