MN-UV-Smart

Maskless direct laser
writing equipment

    Based on UV lithography, the MN-UV-Smart lithography system combines SLM maskless printing technologies, making it the optimal tool for rapid prototyping and wafer-scale batch processing of virtually any 2D and 2.5D structures.
           The compact and integrated design, fully automatic control, powerful and user-friendly workflow, high writing speed, and high resolution make it suitable for rapid prototyping and small batch production, with applications in microfluidics, semiconductors, biomedical engineering, and microelectronics.

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Technical specifications
Write mode
Nano
Standard
X
Minimum feature size
0.3 µm
1 µm
4 µm
Minimum lines and spaces
0.45 µm
1 µm
5 µm
Global 2nd layer alignment [3σ, nm]
0.5 µm
0.5 µm
1.0 µm
Maximum write speed
40 mm 2 /min
900 mm 2 /min
3000 mm 2 /min
Light source
405 nm/365 nm                                          
Substrate sizes
Variable: 50mm×50mm  to 8''×8'' | Optional: 10'' × 10'' Customizable on request
Substrate thickness
 0 -12 mm
Maximum exposure area
50x50mm 2 /100x100mm 2 /200x200mm 2(customized)